IndiaBUILD — what India must build, down to the spec

The living scoreboard

Where the gaps run deepest

843 capabilities · 21 sectors · 102 being built

01 Semiconductors 123 of 299 red 02 Aerospace 117 of 262 red 03 Semiconductor Equipment 25 of 54 red 04 Marine & Shipbuilding 10 of 12 red 05 Space Systems 9 of 55 red 06 Power & Energy Systems 9 of 12 red

In focus · Aerospace Vacuum investment casting India has demonstrated vacuum investment casting capability via DRDO/DMRL for single-crystal and directionally solidified blades, but faces structural gaps in production scale, indigenous supply chain, and knowledge transfer to industry partners. Demonstrated· critical criticality

What moved recently

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2026-07-15 High-resolution data converter IP (ADC/DAC) → No capability · No documented indigenous ADC/DAC IP design reaching working prototypes or production; India is entirely dependent on imported components from Analog Devices, Texas Instruments, and others for high-resolution converters. status

2026-07-15 Silicon wafer manufacturing → Emerging · Crystal growth R&D exists through Raana Semiconductors (4-6 inch ingots proven, 12-inch target ~4 years away) and some solar-grade wafer joint ventures beginning production, but no commercial-scale semiconductor-grade wafer manufacturing yet operational in India. status

2026-07-15 HEMT device design → Demonstrated · IISc developed India's first e-mode GaN HEMT (2019-2020) with performance comparable to commercial devices; DRDO achieved 150W GaN HEMTs and MMICs up to X-band (October 2025); GAETEC has limited production capability but no high-volume output reported. status

2026-07-15 DRAM memory chip → Emerging · Assembly and test facilities operational (Micron, 2026); zero indigenous wafer fab capacity for DRAM; design IP nascent with government support but no production yet. status

2026-07-15 Specialty analog process node → Emerging · SCL operates an indigenous 180nm CMOS analog capability with limited commercial volume; Tata-PSMC fab targets 28-110nm at scale but is still in pre-production phase as of mid-2026. status

2026-07-15 Chemical mechanical planarization → Emerging · A research-stage pad manufacturing hub was inaugurated in July 2026 with 18-24 month commercialization target; CMP slurry remains entirely imported with only experimental domestic entries. status

2026-07-15 Leading-edge logic processor → Emerging · The Tata-PSMC fab (28-110nm) targets first silicon in late 2026; India has demonstrated isolated chip designs (SHAKTI, VIKRAM 3201) but no production-scale leading-edge logic manufacturing capability. status

2026-07-15 Analog/RF test and characterization equipment → No capability · No indigenous production of analog/RF test equipment found; all commercial OSAT/ATMP facilities use imported systems from Teradyne, Advantest, Keysight, or NI. status

2026-07-15 Analog and mixed-signal IC → Emerging · India has R&D programmes, early-stage startups, and design services, but no indigenous volume manufacturing of analog ICs; capability remains limited to fabless design and IP development. status

2026-07-15 3D vertical NAND stacking architecture → No capability · India manufactures less than 1% of global semiconductors with zero indigenous 3D NAND production or foundational R&D programs; all commercial 3D NAND originates from Samsung, SK Hynix, Kioxia, Micron, and YMTC (China). status