Every dated status change and builder update, newest first. Progress is the plot.
2026-07-153D vertical NAND stacking architecture → No capability · India manufactures less than 1% of global semiconductors with zero indigenous 3D NAND production or foundational R&D programs; all commercial 3D NAND originates from Samsung, SK Hynix, Kioxia, Micron, and YMTC (China).status
2026-07-15High-purity precursor chemistry → Emerging · Government policy and initial private investment exist but production remains minimal; no commercial-scale indigenous manufacturing of semiconductor-grade precursors demonstrated yet.status
2026-07-15SiC single-crystal boule growth → Emerging · Indigenous R&D capability exists (C-MET 2-inch boule, SSPL 4-inch wafers for devices), but no commercial production yet; SiCSem fab approved but not operational until 2027-28.status
2026-07-15Advanced transistor architecture (FinFET/GAA) → No capability · India has no indigenous capability to produce FinFET or GAA transistors at any commercial or production scale; all semiconductor fabs approved are below 28nm, limited to mature planar or early FinFET nodes, with no GAA roadmap announced.status
2026-07-15Thin-film deposition (CVD/ALD) → No capability · India has zero indigenous capability for CVD/ALD equipment or process development; the country depends entirely on imports with no documented domestic manufacturing or advanced R&D programs in this specific technology.status
2026-07-15Analog/mixed-signal EDA tools → No capability · No indigenous analog/mixed-signal EDA tools exist at any stage; India imports all such software, with ChipIN and DLI schemes providing subsidized access to global vendors' tools rather than developing domestic alternatives.status
2026-07-15Photolithography (DUV/EUV) → No capability · India has no indigenous capability to manufacture DUV or EUV lithography systems; all photolithography equipment comes from imports, primarily ASML (EUV) and ASML/Nikon/Canon (DUV).status
2026-07-15Cryogenic rocket engine → Producing · CE-20 cryogenic engine is in operational production, proven through 8 consecutive LVM3 flights, human-rated for Gaganyaan, with manufacturing transferred to HAL's ICMF operational since 2023.status
2026-07-15Full-flow EDA toolchain (RTL to GDSII) → No capability · No indigenous full-flow EDA toolchain exists in production or competitive form; India entirely depends on imports from Synopsys, Cadence, and Siemens, while open-source/demonstration tools operate only at research and legacy nodes (180nm, 130nm).status
2026-07-15EUV photoresist chemistry → No capability · India has no known indigenous EUV photoresist development programme, production capability, or commercial effort; the country remains entirely dependent on imports from Japan and South Korea.status
2026-07-15Smartphone system-on-chip (SoC) → Emerging · Multiple Indian fabless design startups (Mindgrove, Netrasemi, InCore) have taped out chips for niche applications, but no indigenous smartphone-grade SoC exists; all smartphone SoCs sold in India are imported.status
2026-07-15Advanced process design kit and EDA toolchain → Emerging · India has launched a silicon photonics PDK in April 2026 and provides subsidized access to foreign EDA tools via national grid, but possesses no indigenous general-purpose EDA toolchain or CMOS process design kits at advanced nodes.status
2026-07-15Ultra-pure process chemicals and gases → Emerging · Several Indian companies are scaling production of semiconductor-grade chemicals and gases with government backing, but remain heavily dependent on imports for most specialty chemicals and electronic-grade gases.status
2026-07-15Floating-gate / charge-trap transistor cell → No capability · India has no demonstrated capability in floating-gate or charge-trap transistor cell design or fabrication; only assembly and packaging operations exist domestically.status
2026-07-15Memory design EDA tools → No capability · No evidence of indigenous R&D, prototype, or production of memory design EDA tools; India relies entirely on imported tools from global vendors.status
2026-07-15High-purity silicon wafers → Emerging · A 2 GW solar wafer fab (Premier Energies-SAS JV) is under construction targeting June 2026 start; semiconductor-grade wafer production remains entirely dependent on imports and at R&D stage only.status
2026-07-15High-power pulsed CO2 laser amplifiers → No capability · No indigenous Indian R&D programme or capability in pulsed CO2 laser amplifiers for semiconductor or industrial applications identified; DRDO efforts focus on solid-state and hybrid gas lasers for defence, not CO2 amplifiers.status
2026-07-15Voltage/frequency reference IP → Emerging · SCL has designed and characterized analog IP including voltage regulators and references in 180nm CMOS for space applications, but production is limited to defense/space and India imports commercial reference ICs.status
2026-07-15Tin droplet generator and delivery system → No capability · No indigenous tin droplet generator or EUV light source subsystem exists in India; the country remains entirely dependent on ASML (Netherlands) for any EUV capability.status
2026-07-15Silicon carbide power semiconductor → Emerging · DRDO has demonstrated laboratory-scale 4-inch SiC wafer production and device fabrication; multiple commercial fabs in early construction phase but not yet at production volume.status
2026-07-15High-purity semiconductor-grade silicon wafers → No capability · India currently produces zero commercial-scale semiconductor-grade silicon wafers and remains fully dependent on imports; only small-scale R&D and prototype efforts exist.status
2026-07-15On-chip precision passive components → No capability · No evidence of Indian design or fabrication capability for on-chip integrated passive components; India imports all advanced IC designs and relies on foundry partners overseas for complex analog/mixed-signal chips requiring integrated passives.status
2026-07-15Analog IC design expertise → Emerging · R&D and programmes exist (academic, multinational centres, startups) but no indigenous production of competitive analog ICs at scale; India remains highly import-dependent.status
2026-07-15Cleanroom fabrication facility → Demonstrated · Micron's commercial OSAT cleanroom facility (500,000 sqft) opened in Sanand, Gujarat in Feb 2026; multiple other commercial cleanroom assembly/test facilities are operational or near-operational, but no indigenously-developed advanced wafer fab cleanroom exists yet.status
2026-07-15SiC epitaxial growth → Emerging · DRDO achieved 4-inch SiC wafer production and GaN/SiC MMICs in November 2024; RIR Power Electronics began epitaxy wafer production phase-1 planned for December 2025; no volume manufacturing yet.status
2026-07-15DRAM capacitor cell architecture → No capability · India operates only OSAT (assembly/test) facilities for finished DRAM wafers; no indigenous DRAM capacitor cell design or wafer fabrication; India Semiconductor Mission targets mature nodes (28nm+), not memory.status
2026-07-15High-aspect-ratio etching → No capability · India lacks any indigenous capability to design, manufacture, or deploy high-aspect-ratio etching equipment; all systems are imported from global vendors; research use only at academic labs.status
2026-07-15Specialized precision-engineering supplier ecosystem → No capability · No indigenous production ecosystem exists; India is fully dependent on imports for fab equipment, with only nascent engineering services and component suppliers, none operating at production scale for semiconductor-grade precision components.status
2026-07-15NAND flash memory chip → Emerging · Micron's ATMP facility began volume production in Feb 2026 for DRAM and NAND assembly/testing of imported wafers; no wafer fab or chip design capability exists domestically.status